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Core I3-6100 SR2HG Desktop Computer Processor I3 Series (3MB Cache,up to 3.7GHz ) - Desktop CPU
The Core i3-6100 comes with two-core, four-thread configuration, delivering the performance and capability you need for everyday home and office tasks, as well as a host of new features to help you make the most of your PC experience.
The 6th generation Intel Core processor is based on the Skylake micro architecture and built with 14nm manufacturing process. It comes packed with advanced features to take your productivity, creativity and 3D gaming to the next level.
| Processor number | i3-6100 |
| Family | Core i3 |
| Technology (micron) | 0.014 |
| Processor speed (GHz) | 3.7 |
| L2 cache size (KB) | 512 |
| L3 cache size (MB) | 3 |
| The number of cores | 2 |
| EM64T | Supported |
| HyperThreading technology | Supported |
| Virtualization technology | Supported |
| Enhanced SpeedStep technology | Supported |
| Execute-Disable bit feature | Supported |
General Information:
| Type | CPU / Microprocessor |
| Market segment | Desktop |
| Family | |
| Model number | |
| Frequency | 3700 MHz |
| Bus speed | 8 GT/s DMI |
| Clock multiplier | 37 |
| Package | 1151-land Flip-Chip Land Grid Array |
| Socket | Socket 1151 / H4 / LGA1151 |
| Size | 1.48" x 1.48" / 3.75cm x 3.75cm |
| Introduction date | September 1, 2015 (announcement) September 1, 2015 (availability in Asia) September 27, 2015 (availability elsewhere) |
Architecture Microarchiteture:
| Microarchitecture | Skylake |
| Processor core | Skylake-S |
| Core stepping | S0 (QJZG, SR2HG) |
| Manufacturing process | 0.014 micron |
| Data width | 64 bit |
| The number of CPU cores | 2 |
| The number of threads | 4 |
| Floating Point Unit | Integrated |
| Level 1 cache size | 2 x 32 KB 8-way set associative instruction caches 2 x 32 KB 8-way set associative data caches |
| Level 2 cache size | 2 x 256 KB 4-way set associative caches |
| Level 3 cache size | 3 MB 12-way set associative shared cache |
| Physical memory | 64 GB |
| Multiprocessing | Uniprocessor |
| Extensions and Technologies |
|
| Low power features | Enhanced SpeedStep technology |
Integrated peripherals / components:
| Display controller | 3 displays |
| Integrated graphics | GPU Type: HD 530 Graphics tier: GT2 Microarchitecture: Gen 9 Execution units: 24 Base frequency (MHz): 350 Maximum frequency (MHz): 1050 |
| Memory controller | The number of controllers: 1 Memory channels: 2 Supported memory: DDR3L-1333, DDR3L-1600, DDR4-1866, DDR4-2133 Maximum memory bandwidth (GB/s): 34.1 ECC supported: Yes |
| Other peripherals |
|
Electrical / Thermal parameters:
| Maximum operating temperature | 100°C |
| Thermal Design Power | 51 Watt |