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CPU Processor Chip Core M3-7Y30 SR347 ( 4MB Cache 2.6GHz ) notebook/Laptop Processor

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CPU Processor Chip Core M3-7Y30 SR347 ( 4MB Cache 2.6GHz ) notebook/Laptop Processor

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Model Number :HE8067702739824
Certification :Original Parts
MOQ :1 piece
Price :Negotiation
Payment Terms :T/T, PayPal, Western Union, Escrow and others
Supply Ability :500-2000pcs per month
Delivery Time :3-5 work days
Packaging Details :10cm X 10cm X 5cm
Processor Number :M3-7Y30
Product Collection :7th Generation Core™ m Processors
Code Name :Products formerly Haswell
Market Segment :Mobile
Status :Launched
Launch Date :Q3'16
Lithographyptions Available :14nm
Use Condition :notebook
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CPU Processor Chip Core M3-7Y30 SR347 ( 4MB Cache 2.6GHz ) notebook/Laptop Processor

Core m3-7Y30 is a very efficient dual-core SoC for tablets and passively cooled notebooks based on the Kaby Lake architecture and was announced in the end of August 2016. The CPU consists of two processor cores clocked at 1.0-2.6 GHz (2-core Turbo not specified yet). Thanks to Hyper Threading, the processor can execute up to four threads simultaneously. The chips also includes the Intel HD Graphics 615 GPU, a dual-channel memory controller (DDR3L/LPDDR3) as well as VP9 and H.265 video de- and encoder. It is still produced in a 14 nm process with FinFET transistors.

Processor number m3-7Y30

Processor number m3-7Y30
Family Core m3
Technology (micron) 0.014
Processor speed (GHz) 1
L2 cache size (KB) 512
L3 cache size (MB) 4
The number of cores 2
EM64T Supported
HyperThreading technology Supported
Virtualization technology Supported
Enhanced SpeedStep technology Supported
Execute-Disable bit feature Supported

Generation Imformation:

Type CPU / Microprocessor
Market segment Mobile
Family
Intel Core m3
Model number m3-7Y30
CPU part number
  • HE8067702739824 is an OEM/tray microprocessor
Frequency 1000 MHz
Maximum turbo frequency 2600 MHz (1 core)
2400 MHz (2 cores)
Clock multiplier 10
Package 1515-ball micro-FCBGA
Socket BGA1515
Size 0.79" x 0.65" / 2cm x 1.65cm
Introduction date August 30, 2016

Architecture / Microarchitecture:

Microarchitecture Kaby Lake
Processor core Kaby Lake-Y
Core stepping H0 (SR2ZY, SR347)
Manufacturing process 0.014 micron
Data width 64 bit
The number of CPU cores 2
The number of threads 4
Floating Point Unit Integrated
Level 1 cache size 2 x 32 KB 8-way set associative instruction caches
2 x 32 KB 8-way set associative data caches
Level 2 cache size 2 x 256 KB 4-way set associative caches
Level 3 cache size 4 MB 16-way set associative shared cache
Physical memory 16 GB
Multiprocessing Not supported
Extensions and Technologies
  • MMX instructions
  • SSE / Streaming SIMD Extensions
  • SSE2 / Streaming SIMD Extensions 2
  • SSE3 / Streaming SIMD Extensions 3
  • SSSE3 / Supplemental Streaming SIMD Extensions 3
  • SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4
  • AES / Advanced Encryption Standard instructions
  • AVX / Advanced Vector Extensions
  • AVX2 / Advanced Vector Extensions 2.0
  • BMI / BMI1 + BMI2 / Bit Manipulation instructions
  • F16C / 16-bit Floating-Point conversion instructions
  • FMA3 / 3-operand Fused Multiply-Add instructions
  • EM64T / Extended Memory 64 technology / Intel 64
  • NX / XD / Execute disable bit
  • HT / Hyper-Threading technology
  • VT-x / Virtualization technology
  • VT-d / Virtualization for directed I/O
  • TBT 2.0 / Turbo Boost technology 2.0
  • MPX / Memory Protection Extensions
  • SGX / Software Guard Extensions
Low power features Enhanced SpeedStep technology

Integrated peripherals / components:

Display controller 3 displays
Integrated graphics GPU Type: Intel HD 615
Graphics tier: GT2
Microarchitecture: Gen 9 LP
Base frequency (MHz): 300
Maximum frequency (MHz): 900
Memory controller The number of controllers: 1
Memory channels: 2
Supported memory: DDR3L-1600, LPDDR3-1866
Maximum memory bandwidth (GB/s): 29.9
Other peripherals PCI Express 3.0 interface (10 lanes)

Electrical / Thermal parameters:

Maximum operating temperature 100°C
Thermal Design Power 4.5 Watt
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