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China Core I3-6006U SR2JG Computer Hardware Processor I3 Series 3MB Cache Up To 2.0GHz wholesale

Core I3-6006U SR2JG Computer Hardware Processor I3 Series 3MB Cache Up To 2.0GHz

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Model Number :I3-6006U SR2JG

Certification :ORIGINAL PARTS

MOQ :1 piece

Price :Negotiation

Payment Terms :T/T, PayPal, Western Union, Escrow and others

Supply Ability :1000pcs

Delivery Time :3-5 work days

Packaging Details :tray, 10cmX10cmX5cm

Porcessor Number :I3-6006U

Product Collection :6th Generation Core i3 Processors

Code Name :Products formerly Skylake

Market Segment :Mobile

Status :Launched

Launch Date :Q4'16

Lithography :14nm

Use Conditon :NOTEBOOK / LAPTOP

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CPU Processor Chip Core I3-6006U SR2JG I3 Series (3MB Cache,up to 2.0GHz ) - Notebook Processor

The Core i3-6006U is an ULV (ultra low voltage) dual-core SoC based on the Skylake architecture and has been launched in November 2016. The CPU can be found in small and light notebooks. In addition to two CPU cores with Hyper-Threading clocked at (rather low) 2 GHz (no Turbo Boost), the chip also integrates an HD Graphics 520 GPU (clocked at only 900 MHz) and a dual-channel DDR4-2133/DDR3L-1600 memory controller. The SoC is manufactured using a 14 nm process with FinFET transistors.

Processor number i3-6006U

Processor number	i3-6006U
Family	Core i3 Mobile
Technology (micron)	0.014
Processor speed (GHz)	2
L2 cache size (KB)	512
L3 cache size (MB)	3
The number of cores	2
EM64T	Supported
HyperThreading technology	Supported
Virtualization technology	Supported
Enhanced SpeedStep technology	Supported
Execute-Disable bit feature	Supported

General Information:

Type	CPU / Microprocessor
Market segment	Mobile
Family	Intel Core i3 Mobile
Model number ?	i3-6006U
CPU part number	§ FJ8066201931106 is an OEM/tray microprocessor
Frequency ?	2000 MHz
Clock multiplier ?	20
Package	1356-ball micro-FCBGA
Socket	BGA1356
Size	1.65" x 0.94" / 4.2cm x 2.4cm
Introduction date	November 2016

Architecture Microarchiteture:

Microarchitecture	Skylake
Processor core	Skylake-U
Core stepping	D1 (SR2UW)
Manufacturing process	0.014 micron
Data width	64 bit
The number of CPU cores	2
The number of threads	4
Floating Point Unit	Integrated
Level 1 cache size	2 x 32 KB 8-way set associative instruction caches 2 x 32 KB 8-way set associative data caches
Level 2 cache size	2 x 256 KB 4-way set associative caches
Level 3 cache size	3 MB 12-way set associative shared cache
Physical memory	32 GB
Multiprocessing	Not supported
Features	§ MMX instructions § SSE / Streaming SIMD Extensions § SSE2 / Streaming SIMD Extensions 2 § SSE3 / Streaming SIMD Extensions 3 § SSSE3 / Supplemental Streaming SIMD Extensions 3 § SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4 § AES / Advanced Encryption Standard instructions § AVX / Advanced Vector Extensions § AVX2 / Advanced Vector Extensions 2.0 § BMI / BMI1 + BMI2 / Bit Manipulation instructions § F16C / 16-bit Floating-Point conversion instructions § FMA3 / 3-operand Fused Multiply-Add instructions § EM64T / Extended Memory 64 technology / Intel 64 § NX / XD / Execute disable bit § HT / Hyper-Threading technology § VT-x / Virtualization technology § VT-d / Virtualization for directed I/O § MPX / Memory Protection Extensions § SGX / Software Guard Extensions
Low power features	Enhanced SpeedStep technology

Integrated peripherals / components:

Display controller	3 displays
Integrated graphics	GPU Type: HD 520 Graphics tier: GT2 Microarchitecture: Gen 9 LP Execution units: 24 Base frequency (MHz): 300 Maximum frequency (MHz): 900
Memory controller	The number of controllers: 1 Memory channels: 2 Supported memory: DDR3L-1600, LPDDR3-1866, DDR4-2133 Maximum memory bandwidth (GB/s): 34.1
Other peripherals	§ PCI Express 3.0 interface (12 lanes) § SATA controller § USB controller § USB OTG § eMMC 5.0 § SDXC 3.0 § Legacy I/O

Electrical / Thermal parameters:

Maximum operating temperature	100°C
Thermal Design Power	15 Watt