Beijing Silk Road Enterprise Management Services Co.,LTD
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DRAM Memory Chip K3RG3G30MM-MGCH 3GB LPDDR Memory Chip
Feature:
Lifecyle :Active
EU RoHS :Unknown
EU RoHS Version:2002/95/EC
Description: M-DIE LOW POWER DDR4 DRAM 24GB DENSITY Taxonomy
Memory > Memory Chips > DRAM Chip
Introduction Date:2016-01-19 00:00:00
ECCN:EAR99
Supplier Cage Code:1542F
Basic Package Type:Ball Grid Array
Package Family Name:BGA
Supplier Package:FBGA
Package Description:Fine Pitch Ball Grid Array
Lead Shape:Ball
Pin Count:366
PCB:366
Tab:N/R
Package Length (mm):N/A
Package Width (mm):N/A
Package Height (mm):N/A
Package Diameter (mm):N/R
Package Weight (g):N/A
Mounting:Surface Mount