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Beijing Silk Road Enterprise Management Services Co.,LTD

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32GNAND+24GLPD3 FBGA221 FW A4 Embedded Multi Chip Package , Mcp Flash H9TQ26ADFTACUR-KUM

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China 32GNAND+24GLPD3 FBGA221 FW A4 Embedded Multi Chip Package , Mcp Flash H9TQ26ADFTACUR-KUM wholesale
  • China 32GNAND+24GLPD3 FBGA221 FW A4 Embedded Multi Chip Package , Mcp Flash H9TQ26ADFTACUR-KUM wholesale
  • China 32GNAND+24GLPD3 FBGA221 FW A4 Embedded Multi Chip Package , Mcp Flash H9TQ26ADFTACUR-KUM wholesale
  • China 32GNAND+24GLPD3 FBGA221 FW A4 Embedded Multi Chip Package , Mcp Flash H9TQ26ADFTACUR-KUM wholesale

32GNAND+24GLPD3 FBGA221 FW A4 Embedded Multi Chip Package , Mcp Flash H9TQ26ADFTACUR-KUM
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Model Number :H9TQ26ADFTACUR-KUM
Certification :Original Parts
MOQ :1 piece
Price :Negotiation
Payment Terms :T/T, PayPal, Western Union, Escrow and others
Packaging Details :10cm X 10cm X 5cm
Supply Ability :500-2000pcs per month
Delivery Time :3-5 work days
Part Numbe :H9TQ26ADFTACUR-KUM
Application :Mobile Phone
Product :eMCP
Density :32GB
NAND Information :32+24 eMCP-D3
Package Type :221 ball FBGA
Dissipation Power :5W
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EMCP Memory Chip H9TQ26ADFTACUR-KUM -32GNAND+24GLPD3 FBGA221 FW:A4-Embedded Multi-Chip Package NEW&ORIGINAL Storage

Featur and Description:

Part Number Density Organization Temperature Product Grade Voltage PKG Product Status
H9TQ26ADFTACUR-KUM 32GB SDP 1℃-100℃ IT 5v FBGA221 Mass Production
Product Tags:

optiplex 745

optiplex gx620

standalone gpon olt fd1508gs
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