Beijing Silk Road Enterprise Management Services Co.,LTD

Integrity management, solidarity and mutual help, innovation and change, pragmatism and efficiency.

Manufacturer from China
Verified Supplier
7 Years
Home / Products / Laptop CPU Processors /

14nm Lithography Laptop CPU Processors Celeron N3350 SR2Z7 2M Cache Up To 2.4 GHz

Contact Now
Beijing Silk Road Enterprise Management Services Co.,LTD
Visit Website
Country/Region:china
Contact Now

14nm Lithography Laptop CPU Processors Celeron N3350 SR2Z7 2M Cache Up To 2.4 GHz

Ask Latest Price
Video Channel
Model Number :FH8066802980002 N3350
Certification :ORIGINAL PARTS
MOQ :1piece
Price :Negotiation
Payment Terms :T/T, PayPal, Western Union, Escrow and others
Packaging Details :tray, 10cmX10cmX5cm
Porcessor Number :N3350 SR2Z7
Product Collection :Celeron Processor N Series
Code Name :formerly Apollo Lake
Market Segment :MOBILE
StatusLaunch Date :Launched
Launch Date :Q3'16
Lithography :14nm
Use Conditon :PC/Client/Tablet
more
Contact Now

Add to Cart

Find Similar Videos
View Product Description

CPU Processor Chip Celeron N3350 SR2Z7 ( 2M Cache, up to 2.4 GHz) - Notebook/Latop CPU

N3350 is a dual-core 64-bit x86 mobile microprocessor introduced by Intel in 2016. The processor is based on Goldmont microarchitecture and is manufactured on a 14 nm process. The chip operates at 1.1 GHz with burst frequency of 2.4 GHz and has a TDP of 6 W (SDP of 4 W).

14nm Lithography Laptop CPU Processors Celeron N3350 SR2Z7 2M Cache Up To 2.4 GHz

Processor number N3350:

Processor number N3350
Family Mobile Celeron
Technology (micron) 0.014
Processor speed (GHz) 1.1
L2 cache size (KB) 2048
The number of cores 2
EM64T Supported
HyperThreading technology Not supported
Virtualization technology Supported
Enhanced SpeedStep technology Supported
Execute-Disable bit feature Supported

General information
Type System-on-a-Chip
Market segment Mobile
Family
Intel Mobile Celeron (Apollo Lake)
Model number N3350
SoC part number
  • FH8066802980002 is an OEM/tray SoC
Frequency 1100 MHz
Maximum turbo frequency 2400 MHz (1 core)
2300 MHz (2 cores)
Low power frequency 800 MHz
Package 1296-ball Flip Chip Ball Grid Array (Type 3)
Socket BGA1296
Size 1.22" x 0.94" / 3.1cm x 2.4cm
Introduction date August 30, 2016

Integrated peripherals / components
Display controller
  • 3 displays
  • MIDI-DSI 1.1 / DP 1.2 / HDMI 1.4b / eDP 1.3
  • DP output supports up to 4096 x 2160 at 60 Hz
  • eDP and HDMI supports up to 3840x2160 at 30 Hz
Integrated graphics GPU Type: Intel HD 500
Microarchitecture: Gen 9 LP
Execution units: 12
Base frequency (MHz): 200
Maximum frequency (MHz): 650
Memory controller The number of controllers: 1
Memory channels: 2
Channel width (bits): 64
Supported memory: DDR3L-1333, DDR3L-1600, DDR3L-1866, LPDDR3-1333, LPDDR3-1600, LPDDR3-1866, LPDDR4-1600, LPDDR4-2133, LPDDR4-2400
Maximum memory bandwidth (GB/s): 38.4
Other peripherals
  • PCI Express 2.0 interface (6 lanes)
  • Image Signal Processor
  • HD Audio
  • eMMC and SD-Card interfaces
  • I2S interface
  • I2C controler
  • SPI interface
  • High-Speed UART
Supported interfaces
  • 6x USB 3.0 ports
  • 2x SATA 3 ports

Electrical / Thermal parameters

Maximum operating temperature 105°C
Thermal Design Power 6 Watt

Inquiry Cart 0